JPH0118594B2 - - Google Patents

Info

Publication number
JPH0118594B2
JPH0118594B2 JP58118697A JP11869783A JPH0118594B2 JP H0118594 B2 JPH0118594 B2 JP H0118594B2 JP 58118697 A JP58118697 A JP 58118697A JP 11869783 A JP11869783 A JP 11869783A JP H0118594 B2 JPH0118594 B2 JP H0118594B2
Authority
JP
Japan
Prior art keywords
conductive pattern
dry film
film layer
substrate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58118697A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6010697A (ja
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP11869783A priority Critical patent/JPS6010697A/ja
Publication of JPS6010697A publication Critical patent/JPS6010697A/ja
Publication of JPH0118594B2 publication Critical patent/JPH0118594B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP11869783A 1983-06-29 1983-06-29 多層配線基板の製造方法 Granted JPS6010697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11869783A JPS6010697A (ja) 1983-06-29 1983-06-29 多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11869783A JPS6010697A (ja) 1983-06-29 1983-06-29 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6010697A JPS6010697A (ja) 1985-01-19
JPH0118594B2 true JPH0118594B2 (en]) 1989-04-06

Family

ID=14742913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11869783A Granted JPS6010697A (ja) 1983-06-29 1983-06-29 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6010697A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3863502B2 (ja) 2003-05-19 2006-12-27 株式会社コナミデジタルエンタテインメント 形態変形玩具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118395A (en) * 1980-02-23 1981-09-17 Tokyo Shibaura Electric Co Method of forming multilayer wire
JPS5817696A (ja) * 1981-07-23 1983-02-01 日立化成工業株式会社 多層印刷配線板の製造法
JPS59115589A (ja) * 1982-12-22 1984-07-04 富士通株式会社 立体配線形成方法

Also Published As

Publication number Publication date
JPS6010697A (ja) 1985-01-19

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